DipTrace

EDA/CAD software for creating schematic diagrams and printed circuit boards.

Shortcuts:

  • Zoom in/out: "+/-"
  • Turn Grid on/off: F11
  • Increase/Decrease grid size: ctrl + "+"/ ctrl + "-"
  • Rotate Component: space bar / "R"

  • Move label of a component: F10

  • Convert to PCB: Ctrl+B

  • Optimize wiring: F12

  • Show/Hide X-Y Axis

Layers:

  • Signal Layers: Layers that contain traces and copper pours
    • Two types of Signal Layers:
      • Signal Layers: Contain traces and copper pours
      • Plane Layers: Inner inside the board , they contain one or several copper pours
  • Non-Signal Layers:
  • Top/Bottom Silk: silkscreen layers where all text and graphical information is automatically added
  • Top/Bottom Mask/Paste Layers: Carry information about solder mask and paste

Gerber Layers

1. Top Assy – this is assembly layer, it includes all shapes/texts placed in Top Assy as well as

objects defined in "View \ Assembly Layers". Assembly layer in this project includes board outline

because it is selected in "View \ Assembly Layers"mainmenu item, but you can select another

object or hide board outline in this layer.

2. Top Silk – includes pattern shapes, texts and all other shapes and texts placed in Top Silk layer.

Do not change settings and click "Preview". Notice that if you use TrueType fonts parts of the text

can be invisible (depends on the font and size), you should make "Recognize Accuracy" value a bit

smaller, but do not applyminimums.

3. TopMask – this is solder mask layer.

4. Top Paste – this layer is used for SMD pads only.

5. Signal layers (Top, Bottom, etc.) - copper layers.

6. BottomPaste, Mask, Silk and Assy layers are just like their analogs fromthe Top side.

7. BoardOutline layer includes board outline with defined width.

8. Board layer includes board as a filled polygon.

9. Top/BottomDimensions - layers created specially for dimensions.

VIAs( Vertical Interconnect Access):

  • Blind Via: Connecting an inner layer to either top layer or to bottom layer
  • Buried Via: Connecting two inner layers without access to top or bottom
  • Through Hole (regular via): Connect top layer to bottom layer passing all through all inner layers.

Copper Pour:

  • refers to an area on a printed circuit board filled with copper (the metal used to make connections in printed circuit boards) (wikipedia page)

  • Used as a low-impedance conductor for Power and Ground nets

  • Pours are usually located on inner layers of the board,but can be placed on top or bottom as well.

  • Copper pour is commonly used to create a ground plane

results matching ""

    No results matching ""